The WiMAX Forum has brought 21 equipment vendors and operators together for the first public mobile WiMAX Forum PlugFest, an interoperability showcase hosted by Bechtel Telecommunications at its Training, Demonstration, and Research Laboratory in Frederick, Maryland. The PlugFest kicked off on Sunday, September 24, 2006 and will conclude on Sunday, October 1.
Participating companies include: Adaptix, Accton Technologies, Airspan, Alcatel, Altair Semiconductor, Alvarion, Beceem Communications, CETECOM-Aeroflex, GCT Semiconductor, Intel, M/A-Com, Motorola, Navini Networks, picoChip, POSDATA, Runcom, Samsung, SEQUANS Communications, SOMA Networks,TTA Labs, Wintegra, and test equipment vendors: CETECOM, Invenova, and Rohde and Schwarz.
The WiMAX Forum also announced that an additional PlugFest will be held at the CETECOM testing facility in Malaga, Spain on October 20-24, 2006 which will focus on incremental service interoperability tests for fixed and stationary applications.
“The PlugFests held over the next two months signify continued momentum in mobile WiMAX product development and progress toward the widespread proliferation of these systems in networks around the world,” said Ron Resnick, President of the WiMAX Forum.
picoChip announced today that it is participating more than any other company in the WiMAX Forum Plugfest this week. Of the 19 industry-leading companies who are working together on interoperability, picoChip reference designs are represented in five of them. The company is involved directly, with partner Wintegra, while Airspan, M/A-Com and CETECOM are all participating with products based on picoChip’s PHY.
Sequans Mobile WiMAX chip, the SQN1110, now sampling, is designed to fit into handsets, smartphones, and PDAs as well as desktop modems and residential gateways, and portable devices such as PC cards, PCI Express mini-cards, USB dongles, and SDIO modules.
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