Sequans Mobile WiMAX chip reference designs in combination with Rohde & Schwarz will present a live demonstration at the WiMAX Forum technical and certification working group, August 21st thru 24th in Munich this week.
Sequans SQN1130 Wave 2 chips (pdf) are said to feature the industry’s highest throughput and lowest power consumption. Sequans’ Wave 2 MIMO chip delivers more than 30 Mbps throughput while drawing less than 280 mW of power in active mode and less than 10 mW in idle mode.
Sequans endorses the Rohde & Schwarz TS8970 radio conformance test system. It is currently undergoing validation testing at the WiMAX Forum testing facility.
Beceem’s Mobile WiMAX chipset, the BCS 200 has also demonstrated a sustainable throughput of 20Mbps, operating the chipset in ‘Category 4’ HARQ mode (the highest performance mode in the WiMAX Forum Profile) and demonstrated a speed of 33 Mbps in the application layer throughput in MIMO mode. CS200 chipset samples and reference design kits are immediately available.
Intel’s WiMAX Connection 2250 is a low-cost system-on-chip that supports IEEE 802.16-2004 and IEEE 802.16e-2005, enabling WiMAX modems for use with fixed or mobile networks. When combined with the Intel WiMAX Multi-Band Radio or third party RF chips, the Intel 2250 enables manufacturers
to create a broad range of WiMAX modems and residential gateways, eventually into phones by 2009.
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