Intel Shrinks and Integrates Atom

Posted by Sam Churchill on

Intel presented new manufacturing technology that it said keeps it on track to launch a new generation of chips for smartphones and tablets, reports Reuters. The new mobile processors may help Intel catch up with Qualcomm and other rivals in the fast-growing mobile market.

Intel also unveiled its new Atom S1200 processor product family. During a media presentation today, Intel described the new processors as the “world’s first” 6-watt, 64-bit SoC for datacenters and enterprise applications.”

The world’s largest chipmaker dominates the PC industry but has been slow to adapt its processors for mobile gadgets that depend on batteries and demand power efficiency.

Intel and IBM went head-to-head with their latest 22-nm technologies in back-to-back papers at the International Electron Devices Meeting on Monday (Dec. 10).

Its next-generation 22-nanometer chips use “SoC” – system-on-a-chip technology. An SoC puts most of a device’s core functions onto one piece of silicon.

Though 22-nanometer Tri-Gate tech is inside mainstream Ivy Bridge processors today — widely used in Windows and Apple laptops — it hasn’t made it into Intel SoCs, which always lag Intel’s PC-centric processors.

Intel competitors, Global Foundaries and Taiwan Semiconductor Manufacturing Company are going to try to accelerate FinFET development. GF’s tech papers imply that the company will deploy a hybrid 22nm-14nm process to make the jump more quickly, reports Extreme Tech.

Intel is applying its 22-nanometer “Tri-Gate” 3D chip technology to SoCs for the first time. That newer 3D tech outperforms current 32-nanometer SoCs by 20 percent to 65 percent, Intel said.

Like its 22nm Ivy Bridge CPUs, the upcoming 22nm SoCs rely on Intel’s Tri-Gate technology. According to Intel engineer Mark Bohr, the 3D transistor structure is the principle reason why the company’s 22nm technology is as strong as it is.

In 2013, Intel will launch its next-generation micro-architecture called Haswell, which will reach a 10W TDP. The net result should be noticeable gains in battery life, and cooler devices, including tablets.

“Intel’s 22 nm SoC technology will be ready for high volume manufacturing in 2013,” Intel said in a copy of the presentation.

Posted by Sam Churchill on Tuesday, December 11th, 2012 at 11:07 am .

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