Broadcom announced today what it calls the smallest LTE-Advanced modem for future smartphones and tablets. The BCM21892 chip, is sampling now to hardware partners and expected to be in production by next year. It can take advantage of LTE Advanced speeds up to 150 Mbps with uploads topping out at 50 Mbps. It will support carrier aggregation, which is an LTE-Advanced technique.
Chip features include:
- 28nm 4G LTE modem with integrated radio and cellular baseband reduces board area by approximately 35 percent
- Supports all 3GPP standards technologies including 4G LTE-Advanced with carrier aggregation, HSPA+, TD-SCDMA and EDGE/GSM
- Integrated IMS/VoLTE capability allows operators to deploy HD voice and other advanced features
- Carrier aggregation enables operators to combine frequency bands and deliver peak 4G LTE speeds
- Supports all 4G LTE bands: B1-29 LTE-FDD and B33-41 LTE TDD
Band 41 (with LTE TDD) is what Clearwire, Softbank and China Mobile will support.
Broadcom says that Voice over LTE calls use 40 percent less battery than calls over traditional cellular networks.
Broadcom is positioning the small chip as a solution for all mobile broadband needs with support for all of the 3GPP standards including LTE FDD and TDD, LTE-Advanced with carrier aggregation, HSPA+, TD-SCDMA and EDGE/GSM.