LTE Chip Storm at MWC

Posted by Sam Churchill on

Mobile phones need chips and LTE chips a bunch were falling in Barcelona this week.

Qualcomm demonstrated LTE carrier aggregation with Category 4 data rates of 150 Mbps, based on Qualcomm’s MDM9225 and MDM9625 Gobi chipsets which will enable commercial device launches in the second half of this calendar year. Qualcomm says their Gobi MDM9x25 chipset, manufactured using a 28nm process, is the first to support 3GPP Release 10 multicarrier HSPA+ and LTE Advanced and was demoed with Sierra Wireless’ AirCard mobile hotspot and Ericsson network infrastructure.

Broadcom, semiconductor leader for wired and wireless communications, is demonstrating the carrier aggregation capabilities of its new 4G LTE-Advanced modem, the BCM21892, at Mobile World Congress this week. Carrier aggregation lets mobile operators join different spectrum bands together to create the equivalent of a contiguous 20MHz channel capable of delivering peak LTE speeds of 150Mbps.

The device supports LTE FDD and TDD with 150/50 Mbps DL/UL peaks speeds and achieves Category 4 performance through support of Rel.10 (LTE-Advanced) carrier aggregation. It features a tuning range that can support any of the dedicated 41 3GPP bands to ensure global carrier and frequency spectrum compatibility.

Broadcom is full of news this week. Some of their press releases include:

Meanwhile, Marvell today announced the inclusion of its chipset in the world’s first commercial deployment of ARM-based servers at Chinese search engine giant Baidu. Baidu is pioneering more cost-effective and environmentally friendly data centers using Marvell’s implementation of ARM in its ARMADA™ XP CPU server SoC that support high-storage light-computing tasks for cloud-based services and application. Baidu is using the new ARM servers in its personal cloud storage application named “Baidu Cloud” (

Marvell says its LTE TDD/FDD quad-core world-mode platform, supports all global 3G and 4G broadband standards, enabling seamless global roaming. Marvell’s LTE solution features support for 5-mode cellular modems, including LTE TDD and FDD, High Speed Packet Access Plus (HSPA+), (TD-HSPA+) and EDGE. Marvell says it is making significant progress on LTE design-wins with global OEMs and expects commercial products based on this platform to be available this year.

Marvell says its PXA1088 is the industry’s most advanced single-chip solution to feature a quad-core processor with support for 3G field-proven cellular modems including High Speed Packet Access Plus (HSPA+), Time division High Speed Packet Access Plus (TD-HSPA+) and Enhanced Data for GSM Environment (EDGE).

Rovi Corporation is showcasing HEVC 720p compression chips integrated with DivX Plus Streaming, to support the rollout of the newly ratified High Efficiency Video Coding (H.265) standard for mobile and consumer electronic devices. HEVC promises to reduce storage and bandwidth cost by up to nearly 50 percent while maintaining quality playback, enabling mobile operators to meet consumers’ demands for streaming content through IP wireless services.

Rovi plans to have an end-to-end solution for professional HEVC content creation, distribution and playback on PC, mobile and consumer electronics devices for high quality content on any device and screen size.

More coverage of Mobile World Congress is available at C/Net, Engadget, The Verge, Tech Crunch, Light Reading, Fierce Wireless, Re-Think Wireless, Phone Arena, Phone Scoop, EE Times, Computer World, Network World, Anandtech, ARM Devices, Gigaom, Blog Runner, PC Magazine, Google Search, TechMeme and ZDNet.

Posted by Sam Churchill on Monday, February 25th, 2013 at 11:54 am .

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